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TDA7269SA
10W+10W STEREO AMPLIFIER WITH MUTE & ST-BY
PRODUCT PREVIEW
s s s s s s s s s
WIDE SUPPLY VOLTAGE RANGE UP TO +20V SPLIT SUPPLY 10+10W @THD = 10%, RL= 8, VS = 14V NO POP AT TURN-ON/OFF MUTE (POP FREE) STAND-BY FEATURE (LOW Iq) SHORT CIRCUIT PROTECTION TO GND THERMAL OVERLOAD PROTECTION CLIPWATT 11 PACKAGE
Clipwatt11 ORDERING NUMBER: TDA7269SA
DESCRIPTION The TDA7269SA is class AB power amplifier assembled in the @ Clipwatt 11 package, specially designed for high quality sound application as Hi-Fi BLOCK DIAGRAM
music centers and stereo TV sets. The TDA7269SA is pin to pin compatible with TDA7269, TDA7269A, TDA7269ASA, TDA7265, TDA7499, TDA7499SA.
+VS 1000F MUTE/ ST-BY IN (L) 1F 3
15K
1F
5 7 + -
4
OUT (L) 18K 4.7 100nF 560
8 15K +5V P 18K GND 9 10
IN- (L)
RL (L)
IN- (R)
560 18K
1F
IN (R)
11
+ 1 6 -VS 1000F
2
OUT (R) 4.7 100nF
RL (R)
D94AU085
June 2003
This is preliminary information on a new product now in development. Details are subject to change without notice.
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ABSOLUTE MAXIMUM RATINGS
Symbol VS IO Ptot Tamb Tstg, Tj DC Supply Voltage Output Power Current (internally limited) Total Power Dissipation (Tamb = 70C) Ambient Operating Temperature (1) Storage and Junction Temperature Parameter Value 22 3 20 0 to 70 -40 to 150 Unit V A W C C
PIN CONNECTION (Top view)
11 10 9 8 7 6 5 4 3 2 1 IN+(1) IN-(1) GND IN-(2) IN+(2) -VS MUTE OUTPUT(2) +VS OUTPUT(1) -VS
D03AU1506
THERMAL DATA
Symbol Rth j-case Rth j-amb Parameter Thermal Resistance Junction-case Max. Thermal Resistance Junction-ambient Value 3.9 48 Unit C/W C/W
Figure 1. Single Supply Application
D1 5.1V R1 10K PLAY 5V 0 MUTE C1 1F R3 15K MUTE Q1 BSX33 R2 15K C2 100F C3 1F IN (L) 5 7 + 8 9 C4 1F IN (R) 11 IN- (L) 3 4 OUT (L) R4 30K R5 1K + 2 IN- (R) R6 30K R7 1K C9 470F +VS C5 1000F C6 0.1F
R8 4.7 C7 0.1F C10 470F
OUT (L)
10 1 6 GND
OUT (R)
R9 4.7 C8 0.1F
OUT (R)
D96AU444A
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ELECTRICAL CHARACTERISTCS (Refer to the test circuit VS = 14V; RL = 8; RS = 50; GV = 30dB, f = 1KHz; Tamb = 25C, unless otherwise specified)
Symbol VS Iq VOS Ib PO Parameter Supply Voltage Range Total Quiescent Current Input Offset Voltage Non Inverting Input Bias Current Output Power THD = 10%; RL = 8; VS = 12.5V; RL = 4; THD = 1%; RL = 8; VS = 12.5V; RL = 4; THD Total Harmonic Distortion RL = 8; PO = 1W; f = 1KHz; RL = 8; PO = 0.1 to 5W; f = 100Hz to 15KHz; RL = 4; PO = 1W; f = 1KHz; RL = 4; VS = 10V; PO = 0.1 to 5W; f = 100Hz to 15KHz; CT SR GOL eN Ri SVR Tj Cross Talk Slew Rate Open Loop Voltage Gain Total Output Noise Input Resistance Supply Voltage Rejection (each channel) Thermal Shut-down Junction Temperature f = 100Hz; VR = 0.5V A Curve f = 20Hz to 22KHz 15 f = 1KHz; f = 10KHz; 50 6.5 70 60 10 80 3 4 20 60 145 8 0.02 1 8 7.5 -25 500 10 10 7.5 7.5 0.03 0.7 Test Condition Min. 5 60 Typ. Max. 20 100 25 Unit V mA mV nA W W W W % % % %
dB dB V/s dB V V K dB C
MUTE FUNCTION [ref +VS] (*) VMUTE AMUTE Mute /Play threshold Mute Attenuation -7 60 -6 70 -5 V dB
STAND-BY FUNCTIONS [ref: +VS] (only for Split Supply) VST-BY AST-BY IqST-BY Stand-by Mute threshold Stand-by Attenuation Quiescent Current @ Stand-by -3.5 -2.5 110 3 6 -1.5 V dB mA
(*) In mute condition the current drawn from Pin 5 must be 650A
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MUTE STAND-BY FUNCTION The pin 5 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to +VS. - When Vpin5 higher than = +VS -2.5V the amplifier is in Stand-by mode and the final stage generators are off. - When Vpin5 between = +VS -2.5V and VS -6V the final stage current generators are switched on and the amplifier is in mute mode. - When Vpin5 lower than = +VS -6V the amplifier is play mode. Figure 2.
+VS (V) 20
t -VS -20
VIN (mV)
Vpin5 (V) VS VS-2.5 VS-6 VS-10
Iq (mA)
0
VOUT (V)
OFF STDBY MUTE
PLAY
STDBY
PLAY
OFF STDBY
D94AU086
MUTE
MUTE
MUTE
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Figure 3. Test and Application Circuit (Stereo Configuration)
+VS C4 C5
R2
C3
MUTE/ ST-BY IN (L) C1
+VS 5 7 + 8 3
R1 SW1 ST-BY DZ
Q1
4
OUT (L) R5 IN- (L) R6 R7 C8
RL (L)
R4 SW2 MUTE
R3
GND
9 10
IN- (R) R8
R9
C2
IN (R)
11
+ 1 6 -VS C7
2
OUT (R) R10 C9
RL (R)
C6
D94AU087B
APPLICATION SUGGESTIONS (Demo Board Schematic) The recommended values of the external components are those shown the demoboard schematic different values can be used, the following table can help the designer.
COMPONENT R1 R2 R3 R4 R5, R8 R6, R9 R7, R10 C1, C2 C3 C4, C6 C5, C7 C8, C9 Dz SUGGESTION VALUE 10K 15K 18K 15K 18K 560 4.7 1F 1F 1000F 0.1F 0.1F 5.1V Frequency Stability Input DC Decoupling St-By/Mute Time Constant Supply Voltage Bypass Supply Voltage Bypass Frequency Stability Mute Circuit Larger On/Off Time PURPOSE Mute Circuit Mute Circuit Mute Circuit Mute Circuit Closed Loop Gain Setting (*) LARGER THAN RECOMMENDED VALUE Increase of Dz Biasing Current Vpin #5 Shifted Downward Vpin #5 Shifted Upward Vpin #5 Shifted Upward Increase of Gain Decrease of Gain Danger of Oscillations Danger of Oscillations Higher Low Frequency Cutoff Smaller On/Off Time Danger of Oscillations Danger of Oscillations Vpin #5 Shifted Upward Vpin #5 Shifted Downward Vpin #5 Shifted Downward SMALLER THAN RECOMMENDED VALUE
(*) Closed loop gain has to be 25dB
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PC Board Figure 4. LC
Figure 5. LS
Figure 6. Component Layout
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HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at T j = 150C, it is important the dimensioning of the Heat Sinker RTh (C/W). The parameters that influence the dimensioning are: - Maximum dissipated power for the device (Pdmax) - Max thermal resistance Junction to case (RTh j-c) - Max. ambient temperature Tamb max - Quiescent current Iq (mA) Example: VCC = 14V, Rload = 8ohm, RTh j-c = 3.9 C/W , Tamb max = 50C 2V cc Pdmax = (N channels) * -------------------------- + I q V c c 2 R lo ad Pdmax = 2 * ( 4.96 ) + 0.84 = 10.7 W 150 - T am b max 150 - 50 (Heat Sinker) R Th c-a = ---------------------------------------- - R T h j-c = --------------------- - 3.9 = 5.4C/W 10.7 P d max In figure 7 is shown the Power derating curve for the device. Figure 7. Power derating curve
2
25
20 (a) Pd (W) 15 (b) 10 (c) 5 a) b) c) Infinite Heatsink 5.0 C/ W 7.0 C/ W
0 0 40 80 Tamb (C) 120 160
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Clipwatt Assembling Suggestions The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 8. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 - 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm2 between it and the plastic body case. As example , if a 15Kg force is applied by the clip on the package , the clip must have a contact area of 1mm2 at least. Figure 8. Example of right placement of the clip
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mm MIN. A B C D E F F1 G G1 H1 H2 H3 L L1 L2 L3 M M1 10.7 19.85 17.9 14.55 11 5.5 2.54 2.54 11.2 0.421 1.57 16.87 1.7 17 12 18.6 0.781 0.700 0.580 0.433 0.217 0.100 0.100 0.441 0.49 0.77 0.8 0.15 1.5 0.55 0.88 0.15 1.83 17.13 0.062 0.664 0.067 0.669 0.480 0.732 0.019 0.030 0.031 TYP. MAX. 3.2 1.05 0.006 0.059 0.002 0.035 0.006 0.072 0.674 MIN. inch TYP. MAX. 0.126 0.041 Weight: 1.80gr
DIM.
OUTLINE AND MECHANICAL DATA
Clipwatt11
0044448
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com
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